Kinghelm/Slkor Executives Song Shiqiang and Qiu Huilin Visit Tencent Penguin Island

1. Counterpoint data shows Samsung’s HBM share rebounded by 12 percentage points quarter-on-quarter to 33%.

2. Apple has accepted Samsung Electronics’ memory chip quotes for Q1 2027: DRAM at nearly $2.0/Gb and NAND at nearly $0.33/Gb, up 30% to 0% compared with Q3 2026.

3. Global 300mm wafer fab equipment spending will jump to $133 billion in 2026, setting a record high (2024: $100.6 billion).

4. The expansion of AI computing power is being transmitted step by step from the chip side to equipment, optical interconnect, and other segments, and the strong momentum of the equipment sector has been validated by data.

5. Executives from Kinghelm (www.kinghelm.net)/Slkor (www.slkoric.com) attended the “Lijincheng Center Enterprises Visit Tencent Penguin Island” event; Song Shiqiang and Qiu Huilin were present!

6. Samsung’s Cheonan plant is shifting Exynos packaging capacity to HBM and scaling down its in-house mobile phone chip business.
   
   

Domestic Tech News:

1. The “15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry” was released, identifying edge AI chips, EDA/IP, and advanced process nodes as key areas to tackle.

2. The 300mm SOI wafer capacity of Xin’ao Xinyi under National Silicon Industry Group will reach about 400,000 wafers/year by the end of 2026, and silicon photonics SOI wafers will be shipped in volume in 2027.

3. The Institute of Semiconductors, Chinese Academy of Sciences, has developed a new type of “ferroelectric tunnel junction” that uses angstrom-level tiny slips between atomic layers to achieve an ultrahigh on/off ratio, with more than 100 billion repeated switching cycles.

4. Yunyinggu Technology Co., Ltd. has established two controlled subsidiaries, namely Shuqing Zhiyun (Shanghai) Technology Co., Ltd. and Xinqing Zhiyun (Shanghai) Technology Co., Ltd., and plans to develop two new businesses: optical interconnect and UCIe IP.

5. Siwei Technology has completed its first round of equity financing, raising a total of nearly RMB 200 million. It is a company focused on the R&D and manufacturing of mid-to-high-end pressure chips and sensor-grade products.

6. Xinlai Zhirong Semiconductor Technology (Shanghai) Co., Ltd. has officially launched its A-share IPO process.
   
   

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