In Q2 2026, the top ten wafer foundries generated nearly US$53.49 billion in revenue

International Tech News:

1. A TrendForce report shows that in Q2 2026, the combined revenue of the world’s top ten wafer foundries reached nearly US$53.49 billion. SMIC’s revenue rose 20% quarter-on-quarter to exceed US$3 billion, with its market share rising to 5.4%, ranking third.

2. Qualcomm and Amazon will jointly develop custom chips for next-generation large-scale AI data centers and expand high-speed optical interconnect solutions.

3. Samsung Electronics will invest 40 billion yen to establish an AI chip packaging R&D center in Yokohama, Japan.

4. Murata Manufacturing (Japan) expects to gradually discontinue production of some specifications in series such as GRM, GRJ, GRT, GXM, GXT, GCM, GCJ, GCG, and ZRA.

5. ASML will break ground on a new large production campus in the Netherlands to expand mass production of extreme ultraviolet (EUV) lithography equipment.

6. Google has hired Hailo’s former VP of R&D to head a new Israeli team dedicated to developing AI chips for robotics and autonomous driving.
   
   

Domestic Tech News:

1. Yaoxin Microelectronics released the world’s first silicon carbide superjunction MOSFET (metal-oxide-semiconductor field-effect transistor) product.

2. Beijing E-Town released the “AI4Chip” Action Plan for the Leapfrog Development of the Integrated Circuit Industry Empowered by Artificial Intelligence (2026–2028).

3. The Slkor (www.slkoric.com) team appeared at Huaqiangbei yesterday, wearing uniform workwear and holding a fan giveaway, attracting the attention of many merchants. Currently, Slkor is offering limited-time special prices on four models: A7, 1N4148W, FR107, and M7. New and existing customers are welcome to inquire.

4. SmartSens launched SC365AT, the industry’s first automotive CMOS image sensor integrating SerDes and an on-chip ISP.

5. Haiguang Xinzheng announced that the company will leverage GlobalFoundries’ silicon photonics technology to advance the deployment and mass production of 6.4T NPO products.

6. A subsidiary of Shenzhen Kaifa Technology has spent RMB 1.85 billion to expand advanced memory chip packaging and testing capacity.
   
   

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