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China's RISC-V main control chip market is expected to exceed RMB 200 billion by 2030.

2026-10-19 166

Slkor BC817-40 meets the requirements of high-frequency and high-gain applications.

International Tech News:

  1. South Korea's LX Semicon has put more than 60 patents covering SiC devices and epitaxial wafers up for sale.

  2. NVIDIA denies discontinuing the RTX 5090 graphics card and says official supply will continue.

  3. Samsung Electronics and SK Hynix jointly unveiled the seventh-generation high-bandwidth memory "HBM4E".

  4. IDC data shows that, affected by rising memory costs, global smartphone shipments in the third quarter of 2026 fell by 22%.

  5. Applied Materials plans to invest USD 5 billion to build the EPIC R&D center, with Intel, Samsung Electronics, Micron, and SK Hynix as founding partners.

  6. JASM's plan to convert its second wafer fab to 3nm chip production has been approved by Japan. The fab's future monthly capacity is set at 6,000 wafers, and it is expected to be completed and put into production in December 2028.


Domestic Tech News:

  1. Jiangyin Zhongde Electronics has successfully developed a high-end chromium etching solution, pioneering "self-purification" technology to fill a domestic gap.

  2. According to Frost & Sullivan data, China's RISC-V main control chip market has grown from about RMB 1.1 billion in 2021 to about RMB 37.7 billion in 2025, and is expected to reach about RMB 219.4 billion by 2030.

  3. Slkor (www.slkoric.com), led by technical backbones from Tsinghua University and Yonsei University, has deeply engaged in silicon carbide power devices and developed into an integrated enterprise covering design, R&D, production, and sales. The international influence of the "Slkor" brand continues to improve, serving tens of thousands of customers worldwide.

  4. Pengcheng Laboratory recently released in Shenzhen a series of technical achievements on the "Super Optical Direct Connection System and Optical Chips" and announced that the domestic optical chip process platform "Hetao Line" has officially been put into operation.

  5. Li Auto's chip company has raised RMB 1.625 billion, with a valuation of up to RMB 17.1 billion.

  6. Another breakthrough in domestic advanced packaging! Boxin Cheng's 16-layer glass-stacked GCP has officially rolled off the production line and entered production.


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