Song Shiqiang Interviewed by Hong Kong Media Ahead of APEC: Huaqiangbei Is a Cradle of Startup Technology Enterprises

Song Shiqiang was interviewed by RTHK Principal Reporter LAM Hon-shan

International Tech News:

1. Ahead of the APEC summit, Song Shiqiang of Slkor Semiconductor, Ruan Shidie of Gedowei Technology, and Cheng Yimu of the Electronics Chamber of Commerce were interviewed by RTHK Principal Reporter LAM Hon-shan in an interview titled “Shenzhen’s High-Tech Development Is Booming: Smart Glasses and Semiconductor Technologies Reach International Levels.” Song Shiqiang described Huaqiangbei as a cradle of startup technology enterprises and noted that the commercial district has transformed in recent years.

2. Infineon has successfully manufactured 300mm silicon carbide wafers, increasing chip output to 2.3 times.

3. Reports say Japan’s Rapidus has not yet produced the SRAM cells required for 2nm chips and may find it difficult to meet its goal of mass-producing 2nm chips by March 2028.

4. Commercial Daily reports that Nvidia’s share price has fallen about 19% this week, with 1 trillion wiped off its market value.

5. Mitsubishi Electric plans to invest 40 billion yen to expand production capacity for optical EML chips.

6. Canon will launch the KrF lithography machine FPA-6400ES6a in early December, for semiconductor manufacturing applications such as memory chips and logic chips.
   
   

Domestic Tech News:

1. The 2026 APEC CEO Summit is expected to draw more than 2,000 participants; Google, Boeing, Charoen Pokphand Group and other Fortune Global 500 companies and well-known enterprises have all applied to attend.

2. The University of Hong Kong (HKU), together with the Advanced Semiconductor and Integrated Circuit Research Centre, has successfully developed the world’s first megawatt-class ultra-wide-bandgap semiconductor power module.

3. Kinghelm/Slkor (www.slkoric.com) is preparing to participate in electronica 2028 in Munich and assigned Song Yuanming, Director of the International Business Department, and Huang Dejun, Manager of the Publicity and Promotion Department, to go to Germany for on-site learning and inspection.

4. C*Core Technology achieved a breakthrough in its automotive electronics chip business; revenue in the first three quarters of 2026 reached RMB 165 million, up 106.12% year on year, with shipments exceeding 40 million units.

5. The registered capital of Guangzhou CanSemi Phase III Integrated Circuit Manufacturing Co., Ltd. increased from RMB 7.5 billion to RMB 9 billion, an increase of 20%.

6. Guilai Semiconductor’s self-developed fully automated laser lift-off equipment for silicon carbide substrates has successfully achieved laser lift-off of 350mm silicon carbide ingots.
   
   

Huang Dejun and Song Yuanming visited electronica in Munich, Germany, for inspection

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