What are the hardware influencing factors (Ipex terminal) that determine Wi-Fi throughput?

    Shenzhen Jinhangbiao Electronics Co., Ltd.(SHENZHENKING HELMELECTRON CO., LTD.) was established in 2007. It is a national high-tech and dual-software certified enterprise, a senior member of the "China Satellite Navigation Association", an enterprise that has obtained the ISO9001 (04617Q13625ROS) quality management certification system, and is improving the IATF16949 automotive quality management system. The main business is the R&D, production and sales of Beidou satellite navigation and Internet of Things terminal application hardware, and the provision of www.BDS666.com logistics information intelligent system solutions.

The impact of hardware on throughput can be distinguished from chip selection, layout design, RF indicator debugging and mold structure. The editor of Jinhangbiao can only give a brief overview here. So, next, the editor of Jinhangbiao will talk to you: the hardware influencing factors that determine Wi-Fi throughput（Ipex terminal）Which ones are there?

a) Chip selection---select the chip suitable for the product application

Parameters related to throughput include PHYlayerdatarate, supportinterface, typicalconductedTxpower, typicalEVM, etc. In addition, the chip's ability to resist packet loss also needs to be measured. The theoretical rate of the physical layer and the type of communication interface supported will directly determine the throughput of the product designed with this chip, the power determines the transmission distance, and the EVM determines the signal modulation quality.

b)Layout design (not introduced in detail here)

The main focus here is to use SI9000 (or other tools) to select the reference layer, the length of the 50ohm microstrip line, the bending and impedance control of the trace, the isolation of multi-channel Wi-Fi signals, the processing of the power supply of the Wi-Fi part, as well as the layout of interference devices, thermal design, shielding design, etc., which will affect the Wi-Fi radio frequency indicators.

c) Conducted RF indicator debugging

 1. Transmit power. The power can be adjusted in design according to the actual application of the product. The power is directly related to the distance of the transmission distance.

2. We also need to focus on EVM here

It measures the deviation of the ideal constellation position of the modulation method corresponding to the demodulated signal. Excessive EVM will lead to symbol errors, data cannot be confirmed and received, worsening to error rate, resulting in packet loss.

3. Sensitivity

Measuring the device's anti-packet loss capability is mainly related to chip capabilities and layout. Shielding measures can also be used to optimize performance. It should be noted that the conduction verification method can only partially reflect the product's anti-interference capability. Wi-Fi OTA's sensitivity test is a more comprehensive verification.

d) Design of mold structure

The main focus is on the space reserved for antenna design, the assembly of the antenna, and whether the appearance material of the entire machine structure will affect wireless signal transmission.

e) Manually welded test board

If the test board’s chips or modules, as well as the Ipex terminals are welded manually, the throughput performance will also be affected.

f) Antenna welding

If a welded antenna is used, the exposure of the coaxial core wire welded to the PCBA antenna feed point will also affect the throughput; if it is a metal patch or plug-in antenna, the amount of tin on it and the flatness of the antenna mounting will also affect the throughput.

The above is the relevant content introduction brought to you by the editor of Laijin Navigation. I hope it will be helpful to you. Thank you for reading!