General Manager Song Shiqiang (left) presents an award to top salesperson Lin Yuanfang. International Tech News: According to reports, in October 2026, DDR5 memory spot prices rose 8% from the previous quarter, with a cumulative increase of 20% over three months. Looktech officially launched a new generation of AI smart glasses, the world's first AI glasses equipped with a brain-computer interface. Applied Materials' $5 billion Silicon Valley EPIC Center was officially unveiled, with Intel, Samsung, Micron, and SK hynix serving as founding partners. Microsoft President Brad Smith said in an interview that AI is currently subject to safety regulation "even less than washing machines and every carton of milk," and urged the UK to take the lead in setting rules for AI. On October 12, Kinghelm (www.kinghelm.net) and Slkor held their September 2026 performance commendation meeting. General Manager Song Shiqiang presented awards to top salesperson Lin Yuanfang and the "Dragon and Tiger Team," Slkor Sales Department 1. As of October 7, 2026, foreign investors held 46.37% of Samsung Electronics shares. Domestic Tech News: Dongfang Suanxin's DF1000 compute chip has officially entered mass production and delivery. ACM Research (Shanghai), Inc.'s single-wafer high-temperature SPM cleaning equipment won the "CIFF China IC Expo Innovation Achievement Award." The first batch of domestic lithography machines "made in Chengdu Shuangliu" from Zhongtewei (Chengdu) Electronic Technology Co., Ltd. will be delivered in batches in early November. Guangxin Holdings Group plans to invest RMB 3.5 billion in Foshan to develop polarizer and new energy electronic separator projects, and invest RMB 3.2 billion in Shaoguan to build a wet-process electronic separator green project. Leadmicro Nano plans to raise no more than RMB 4.944 billion to strengthen its core semiconductor equipment business, with more than RMB 3.225 billion invested in an advanced thin-film deposition technology R&D center project. Dahua Technology plans to contribute RMB 500 million to invest in Ningbo Zhixing Yueheng Venture Capital Partnership (Limited Partnership). Slkor Sales Department 1, led by Sun Gaofei (fourth from right in the front row), won the "Dragon and Tiger Team" title for the fourth time in 2026. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Backend data for SLKOR's "Bridge Rectifier" shows 1.2 million views. International Tech News: Microsoft released its third-generation in-house AI chip, Maia 300, and plans to deploy potentially more than 1 million units next year. Taiwanese media report that Qualcomm will raise shipment prices for Snapdragon X and X2 Elite series PC processors starting in October, with an overall increase of 10%. LG Display plans to use "FLiPP" technology to expand into the IT OLED market. Micron Technology's Q4 FY2026 revenue was $54.229 billion, and net profit was $37.701 billion, up more than 10 times year-on-year. ASML will raise the prices of replacement parts for equipment sold to South Korea by 10%. GlobalFoundries announced that its SPRINT fab expansion project has officially topped out and released its next-generation FD-SOI technology platform, FDX Fusion. Domestic Tech News: Infinigence AI, a domestic AI-native infrastructure company, completed a Series C financing round of RMB 2.3 billion. The company was founded by Professor Wang Yu of Tsinghua University. ChangXin Technology is expected to launch next-generation DDR5 RDIMM products by the end of 2026, integrating advanced technologies such as 4F² architecture and hybrid bonding. The popular science video "Bridge Rectifier" by SLKOR (www.slkoric.com) has reached 1.2 million views on TikTok! This achievement is not only a fruitful result of the company's years of deep cultivation of overseas markets, but also demonstrates the continuous enhancement of SLKOR's brand influence. CanSemi, known as "Guangzhou's No. 1 chip," will be listed on the Shenzhen Stock Exchange on October 13, 2026, with a market value of about RMB 34 billion. Shenghe Microcrystalline released its self-developed SmartPoser®-BD high-performance computing packaging technology platform. China approved and issued the "SparkLink Wireless Communication System" series of national standards (GB/T 48336.101-2026, etc.), which will officially take effect on April 1, 2027. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. Global Semiconductor Sales Top $1 Trillion Year-to-Date Through August Date: October 5, 2026Summary:The Semiconductor Industry Association reported that year-to-date global semiconductor sales passed $1 trillion through August 2026, with four months still remaining in the year. The milestone reflects sustained AI infrastructure demand and broad semiconductor revenue growth.Importance:Sets the scale for the current component cycle and supports expectations that memory, power, packaging and equipment capacity will remain tight into 2027.Source: SIA 2. GlobalFoundries Adds U.S. Silicon Interposer Capacity for AI Packaging Date: October 8, 2026Summary:GlobalFoundries reached an agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging. The deal was reported as a $2 billion TSMC CoWoS interposer agreement. GlobalFoundries also marked a Dresden expansion milestone and outlined a next-generation FD-SOI platform for Physical AI, following a quantum manufacturing partnership with Xanadu.Importance:Builds non-Taiwan capacity for a critical advanced-packaging component and broadens specialty foundry supply for edge AI, robotics and quantum systems.Source: GlobalFoundries; AnySilicon 3. Renesas Expands GaN Portfolio for AI Data Centers and Robotics Date: October 6, 2026Summary:Renesas added its first low-voltage GaN FETs for AI data centers and robotics, extending a portfolio that already includes high-voltage GaN power devices. The products target power density and efficiency in data-center power delivery and compact robotic systems.Importance:Widens the GaN device choices available for high-density power designs and reflects simultaneous demand pull from megawatt-scale data centers and low-voltage edge systems.Source: Renesas 4. DRAM and Foundry Prices Rise Again in October Date: October 7, 2026Summary:Taiwan's Economic Daily News reported that Nanya Technology notified customers of another DRAM contract price increase, with some products rising as much as 20%. UMC, PSMC and Vanguard International Semiconductor also saw tighter utilization and reports of higher foundry pricing, including a reported large increase at PSMC. The price moves follow broad third-quarter increases across analog, MCU, passive and connector products.Importance:Raises bill-of-materials costs for systems using conventional memory or mature-node chips and makes early procurement, multi-source planning and design margin even more important.Source: Economic Daily News; industry notices 5. EsWin Computing Lists in Hong Kong as a RISC-V Chip Pure Play Date: October 9, 2026Summary:Beijing-based EsWin Computing listed on the Hong Kong Stock Exchange under 01256.HK. The IPO priced at HK$1.55 per share, raised more than HK$2.4 billion and opened with a market value of about HK$34 billion. EsWin develops RISC-V-based computing chips and related AI system products.Importance:Gives China's RISC-V chip ecosystem a public funding platform and signals investor support for alternatives to proprietary instruction sets in edge and AI computing.Source: EsWin Computing; HKEX 6. U.S. Opens Section 337 Probe into Vertical Power Delivery Components Date: October 9, 2026Summary:The U.S. International Trade Commission opened investigation 337-TA-1526 into certain vertical power delivery systems, components and products containing them after a patent complaint from Vicor. Respondents include Luxshare Precision, Dongguan Luxshare Technology, Foxconn Industrial Internet and other companies. Luxshare said the accused products are still at the customer development stage and that it will actively respond; Foxconn Industrial Internet also said it would defend itself. The investigation is at the institution stage.Importance:Puts a growing power-delivery component category under trade and patent scrutiny, adding legal risk to AI server and high-density computing supply chains.Source: USITC; Luxshare Precision At Kinghelm At Kinghelm, we track pricing, power delivery and advanced packaging developments because they shape component availability, system cost and design choices. These signals guide our work in RF antennas, connectors, wire harnesses, precision cables and interconnect solutions. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

International Tech News: Qualcomm has acquired RISC-V startup Akeana. NVIDIA CEO Jensen Huang, AMD CEO Lisa Su, and Tesla CEO Elon Musk were awarded the National Medal of Science in recognition of their contributions to semiconductors, artificial intelligence (AI), space technology, and other fields. In 2026, as the three industrial waves of high-voltage adoption, AI computing power, and embodied intelligence converge, isolation chips will rise to become architecture-level components that determine system safety and performance. Apple’s first foldable phone, the iPhone Duo, will begin pre-orders at 8 p.m. on October 16 and officially go on sale on October 23. Kinghelm (www.kinghelm.net) KH-HDMI-0017 HDMI connector, with its superior performance and reliable current support, has become a highly regarded choice in the market. This connector has a rated current of 0.5A MAX and can stably support the transmission of high-resolution, high-refresh-rate audio and video content, delivering an immersive audiovisual experience. Goldman Sachs analysis indicates that the annualized revenue per gigawatt (GW) of AI computing power is approximately US$40 billion to US$50 billion for short-term spot leasing, and approximately US$20 billion to US$30 billion for long-term contracts. Domestic Tech News: CHInano 2026, the 16th International Nanotechnology Industry Expo (abbreviated as the "Nanotech Expo"), will be held from October 21 to 23 at the Suzhou International Expo Center. First-tier packaging and testing giants such as ASE Technology Holding and King Yuan Electronics are experiencing the "strongest wave of price increases in history," while orders at small and medium-sized packaging and testing companies such as Huatai, Chaofeng, and Sigurd Group are also increasing simultaneously. Construction has started on the Lichuan Semiconductor Equipment R&D and Production Base project in Zhangjiagang High-tech Zone (Tangqiao Town), with a total investment of 1.05 billion yuan. In September 2026, GAC Group’s vehicle sales were 128,634 units, down 25.72% year on year. From October 12 to 16, the 26th China International Industry Fair (CIIF2026) is being held at the National Exhibition and Convention Center (Shanghai). Puya Semiconductor plans to acquire a 49% stake in Zhuhai Noah Changtian Storage Technology Co., Ltd. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Last day of the special offer—new and existing customers are welcome to inquire! International Tech News: Korean media reports that, as memory chip prices continue to surge, Samsung’s smartphone business plans to sharply cut smartphone production in Q4 2026, with an estimated reduction of 20% to 30%. Japan’s Sumitomo Bakelite will spend 10 billion yen to add production lines at its Suzhou and Singapore plants to expand semiconductor materials capacity. Synopsys announced that it will work with OpenAI to jointly build a dedicated AI model, GPT-Synopsys, and is exploring partnerships with Chinese AI labs. Apple will launch a new smart home product series on October 13, 2026, with the official event theme "Welcome Home." An IDC report shows that global PC shipments in Q3 2026 were only 62.7 million units, with leading vendors’ shipments falling across the board. TOWA plans to invest 5 billion yen to build a chip manufacturing equipment factory in Kyoto, strengthening Japan’s semiconductor supply chain. Domestic Tech News: Biren Technology’s next-generation GPU was successfully powered on and has entered the post-tapeout verification stage. Biwin Storage’s controlling subsidiary, Guangdong Xincheng Hanqi, completed a RMB 600 million capital increase and share expansion. Slkor Semiconductor (www.slkoric.com) recently completed store image upgrades at its three directly operated stores in Huaqiangbei, welcoming new and existing customers with more comfortable displays and a distinctive image, while service and quality continue to improve. A major semiconductor industry project in Inner Mongolia has landed in the Bayannur Economic and Technological Development Zone, with a total investment of RMB 59.287 billion. TrendForce expects flash memory prices to reach four times their mid-2025 level by the end of 2026, and server memory costs to rise more than sixfold. On October 9, 2026, Beijing ESWIN Computing Technology Co., Ltd. was listed on the Main Board of the Hong Kong Stock Exchange, with a total market capitalization of HK$33.058 billion. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Rendering of Slkor Semiconductor's "Slkor: Chip-Powered Future" advertisement International Tech News: Daishin Securities expects Samsung to regain the largest share of the HBM market in 2027. Tesla plans to start mass production of the humanoid robot Optimus by the end of 2026, with planned annual capacity of 1 million units, equivalent to about 19,000 units per week. Samsung Electronics' Q3 2026 revenue was KRW 195 trillion, up 126.6% year-on-year; operating profit was KRW 107.4 trillion, up 782.5% year-on-year. The MTS2027 Memory Industry Trends Seminar, themed "Chip Light Wave, New Landscape of Memory and Computing," will kick off on December 8, 2026, in Shenzhen, China. Slkor Semiconductor's (www.slkoric.com) "Slkor: Chip-Powered Future" advertisement will soon appear on the streets of Huaqiangbei. This vivid Chinese red heralds the rise of another Chinese "chip" force! In Q2 2026, global Foundry 2.0 market revenue reached USD 96.6 billion, up 25% year-on-year and 11% quarter-on-quarter. Domestic Tech News: The Xinyang Semiconductor Shuyang project, with a total investment of about RMB 700 million, has started construction and is scheduled to officially begin production and operation in June 2027. MetaX Integrated Circuits (Shanghai) Co., Ltd. has wholly established MetaX Integrated Circuits (Chongqing) Co., Ltd. XPeng’s humanoid robot production line is planned to achieve mass production by the end of 2026 and begin commercial delivery in 2027. The Guangzhou Guangxin Semiconductor advanced packaging substrate project has started construction; its target products are high-end FCBGA packaging substrates. The Physical AI/Motor Control Technology Innovation Forum and Advanced Award Ceremony will be held on December 11, 2026, at The Westin Shenzhen Yitian Hotel, Shenzhen, China. It is estimated that by 2031, the number of active AI agents in Chinese enterprise scenarios will reach 350 million. Kinghelm AC/DC Power Connector Products Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

The promotion will end on October 10. New and existing customers are welcome to inquire. International Tech News: Samsung Display will restart its A7 plant area and is expected to build a production line for medium- and large-sized IT OLED panels. South Korea's semiconductor export value reached $60.3 billion in September, a year-on-year increase of 262%. Russia plans to build a semiconductor manufacturing plant for the production of 300mm wafers and semiconductors with process nodes up to 14nm. Applied Materials and Intel are deepening cooperation and will jointly develop next-generation AI chip manufacturing technology. Toshiba plans to invest about 60 billion yen to significantly expand its HDD (hard disk drive) manufacturing facility in the Philippines. Japan's Toppan and Broadcom's new packaging substrate plant in Singapore has officially started production and will create more than 330 new jobs. Domestic Tech News: DeepSeek announced the open-sourcing of infrastructure components for the Ascend computing power platform, covering the TileLang high-level language compilation tool, computing libraries, and distributed communication libraries. Junheng Technology's R&D and manufacturing headquarters base has settled in Wuhan Optics Valley, with an expected investment of 309 million yuan. Slkor Semiconductor's (www.slkoric.com) special offer on four models, A7, 1N4148W, FR107, and M7, will end on October 10. Only the last two days remain. New and existing customers are welcome to inquire about prices and place orders. According to statistics, in the first eight months of this year, China's integrated circuit output exceeded 386 billion units. The high-end compound semiconductor materials and chip industrialization base built by Xiandao Xinguang with an investment of 12 billion yuan has come online in Wuhan Optics Valley. The newly revised Regulations on the Protection of Integrated Circuit Layout Designs will take effect on October 15. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. Vanguard and NXP Open Singapore 300mm Fab for Automotive and Power Chips Date: September 28, 2026Summary:Vanguard International Semiconductor and NXP Semiconductors opened their first 300mm fab in Singapore through joint venture VisionPower Semiconductor Manufacturing Company. The facility will support automotive, industrial, power management, analog and mixed-signal chips using process technologies from 130nm to 40nm. Full production is targeted for 2027, and monthly capacity is expected to reach 44,000 wafers by 2029. The project was revised to a $7.8 billion investment.Importance:Adds mature-node capacity for components that remain essential in vehicles and industrial systems, easing long-term supply constraints even though near-term lead times may remain tight.Source: VIS; NXP 2. Samsung Expects HBM to Consume Nearly 30% of DRAM Capacity in 2027 Date: September 30, 2026Summary:Samsung Electronics Executive Vice President Kim Taewoo said HBM is expected to account for nearly 30% of global DRAM wafer capacity in 2027, up from around 20% currently. Because HBM and conventional DRAM compete for the same wafers, the shift could keep standard memory supply tight and support continued price pressure.Importance:Makes clear that AI memory demand is taking capacity directly from commodity DRAM, with cost consequences for PCs, handsets, networking equipment and other systems.Source: Samsung Electronics 3. Micron and Nanya Expand Advanced Memory Packaging in Taiwan Date: October 1, 2026Summary:Micron's cumulative investment in Taiwan has exceeded NT$1.6 trillion, with expansion underway in Taichung, Tongluo, Taoyuan and Tainan and a second advanced packaging facility in Taichung expected to begin operations in October 2026. Nanya Technology also received approval for an advanced 3D wafer packaging and testing facility in Pingtung focused on TSV and wafer-stacking technologies.Importance:Increases capacity for the advanced packaging steps required by HBM and other high-bandwidth memory, which are becoming as important as wafer capacity in the AI supply chain.Source: Micron; Nanya Technology 4. Toshiba to Double AI Data Center HDD Capacity with $380 Million Investment Date: October 1, 2026Summary:Toshiba plans to double HDD production capacity for AI data centers by fiscal 2027 with about JPY60 billion, or $380 million, of investment in its Philippine operations. The expansion will add lines capable of building drives with up to 40% higher capacity per unit, with 65TB-class products targeted around 2030 and 100TB-class products later. Toshiba aims to raise its storage-capacity market share from just over 10% to 30%.Importance:Confirms that AI storage demand extends beyond NAND and controllers, keeping nearline HDDs a critical component category for cost-sensitive data-center capacity.Source: Toshiba 5. CXMT Commits RMB 34.9 Billion to Next-Generation DRAM Date: September 28, 2026Summary:CXMT announced two projects totaling RMB34.9 billion. A RMB24.1 billion R&D project will run about 30 months and spend roughly RMB22.4 billion on equipment; a separate RMB10.8 billion project will build a DRAM wafer back-end test and module assembly base. The company plans to use RMB18 billion of IPO proceeds.Importance:Moves CXMT beyond a single node milestone toward a more complete DRAM R&D, test and packaging loop, strengthening the domestic memory supply base over time.Source: CXMT; company filing 6. ACM Research Shanghai Orders Jump 88% to RMB 17.1 Billion Date: September 30, 2026Summary:ACM Research said its Shanghai subsidiary had RMB17.1 billion, or about $2.5 billion, in backlog as of September 29, up 88.2% year over year. The equipment portfolio covers cleaning, plating, furnace, coating and developing, PECVD and advanced packaging steps. The figure includes shipped but unrecognized tools and future delivery contracts, and the company did not disclose how much came from leading-edge logic or advanced DRAM lines.Importance:Provides stronger evidence that Chinese fabs are moving from single-tool qualification to larger-scale deployment of domestic equipment, a key support for component capacity expansion.Source: ACM Research At Kinghelm At Kinghelm, we monitor memory, mature-node foundry and advanced packaging capacity because these areas directly affect component cost, lead time and system design. These signals guide our work in RF antennas, connectors, wire harnesses, precision cables and interconnect solutions. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

3D Images of Kinghelm Products on the Official Website (www.kinghelm.com.cn) International Tech News: Chipmaker AMD has agreed to acquire World Labs for US$8.2 billion (approximately RMB 55 billion). Total global demand for indium phosphide substrates in 2026 is expected to reach 2.6–3 million wafers, while effective compliant capacity is only about 750,000 wafers, resulting in a supply-demand gap of more than 70%. It is forecast that global high-speed optical module shipments will approach 180 million units in 2027 and grow to 245 million units by 2028. The China International Industry Fair · Integrated Circuit Exhibition (Guoxin Expo) will be held from October 12 to 16, 2026, at Hall 5.2H, National Exhibition and Convention Center (Shanghai). To help customers make the most of Kinghelm products, 3D images of some products can be downloaded from the Kinghelm official website (www.kinghelm.com.cn). Global semiconductor industry revenue in Q2 2026 is expected to reach US$425.4 billion, up 31.4% quarter-on-quarter. Domestic Tech News: Tsinghua University and collaborators proposed a foundry-oriented, algorithm-driven adaptive optimization manufacturing strategy for 2D chips. TCL CSOT’s MLED project has a total investment of approximately RMB 12.5 billion and plans to build core production lines for LED chips, LED direct-view displays, and other products. The registered capital of Huaqin Technology Co., Ltd. increased from approximately RMB 1.02 billion to approximately RMB 1.52 billion, while that of Hefei Datang Storage Technology Co., Ltd. increased from RMB 285 million to approximately RMB 331 million. The Honor Magic9 series was officially launched, equipped with the self-developed Yuguang H1 imaging chip, among other features. Huchuang Xinwei’s electrostatic chuck headquarters project has settled in Wuxi High-tech District, with a planned total investment of RMB 500 million. Tencent QClaw will officially cease operations at 00:00 on December 24, 2026. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor SM4007PLA7, in SOD-123FL Package International Tech News: Sony requires approximately 8,000 employees at its chip subsidiary to fully return to office to promote Physical AI R&D. SCHMID is collaborating with suppliers including Intel, NVIDIA, and AMD to jointly develop glass substrate equipment. Google parent company Alphabet will launch an experimental satellite carrying its self-developed AI chip on October 1 to verify the feasibility of space AI data centers. Industry insiders estimate that in the fourth quarter of 2026, DRAM and NAND Flash prices will increase by approximately 20% and 30% quarter over quarter, respectively. VSMC, a joint venture between Vanguard International Semiconductor (VIS) and NXP, has officially opened its first 12-inch wafer fab in Singapore, with initial-phase capacity fully sold out. Wolfspeed has launched new Premium high-end power substrates and further expanded its 200 mm silicon carbide (SiC) materials portfolio. Domestic Tech News: United Nova Technology Co., Ltd. expects revenue of approximately RMB 7.766 billion in the first three quarters of 2026, with net profit attributable to shareholders of approximately RMB 681 million, achieving a year-on-year turnaround from loss to profit. Shenzhen MTC Co., Ltd. has achieved volume shipments of its 25G and below DFB optical chips, and its 70/100/200 mW CW DFB chips have entered the testing and verification stage. Slkor (www.slkoric.com) continued to intensify its overseas promotion in the first half of 2026, driving growth in inquiries and orders and greatly increasing brand exposure. Nanjing Guosheng Electronic Co., Ltd., Shengxin Semiconductor, and Jinghua have successively adjusted prices. Among them, Jinghua's silicon epitaxial material products will increase in price by 15%–20%, effective October 1. China Mobile Hubei will join hands with the Zhongguancun Pan-Connectivity Research Institute, Huazhong University of Science and Technology, and others to build a 6G industry trial zone in Wuhan Optics Valley, expected to be completed in 2027. Montage Technology's DDR5 fifth-generation registering clock driver chip (RCD05) has achieved mass production. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. TrendForce estimates that in 2026, the average 8-inch capacity utilization rate of the world’s top ten wafer foundries will rise to 88%, and may reach 90% in the second half of the year.2. Qualcomm (QCOM-US) and Apple (AAPL-US) have renewed their global patent licensing agreement. The new agreement will take effect on April 1, 2027.3. Tower Semiconductor, the world’s leading silicon photonics chip foundry, will build its largest optical communications semiconductor production center in Japan.4. Infineon’s semiconductor plant in Thailand will officially commence production on October 1.5. Kinghelm (www.kinghelm.net) brand products are selling well, including tactile switches, detector switches, slide switches, push-button switches, micro switches, multi-function switches, illuminated switches, DIP switches, toggle switches, sensing switches, limit switches, encoder switches, joystick switches, five-key switches, thumbwheel switches, SMD detector switches, vertical detector switches, through-hole detector switches, SMD encoder switches, etc., as well as Kinghelm models such as KH-IPEX-K501-29, KH-6X6X5H-STM, KH-6X6X5H-Z2J, KH-6X6X6H-STM, KH-VH-PT3.96, KH-SMA-P-8029, KH-3216-H0209, and others.6. According to statistics, in Q2 2026, global data center Ethernet switch market revenue reached USD 12.3 billion, a year-on-year increase of 64.5%. Domestic Tech News: 1. The Tongxin Association Youth Basketball Team won runner-up in the "Hongxing Yutai Cup" 2026 Sichuan-Chongqing Basketball League. Kinghelm and Slkor (www.slkoric.com) were major co-organizers of this competition.2. Kinwong Electronic is expected to officially list on the Main Board of the Hong Kong Stock Exchange on September 29.3. Chixin Semiconductor completed over RMB 200 million in Series A+ financing.4. The OPPO Find X10 Pro Max will be among the first to feature MediaTek’s Dimensity 9600 Pro flagship platform.5. The Phase II, Stage 2 project of Huatian Nanjing Advanced Packaging and Testing Base has topped out, with a total investment of RMB 3 billion. It is expected to be put into use in Q1 2027.6. Xinlian Integration has completed the cumulative paid-in registered capital of RMB 2.129 billion for Xinlian Advanced. Kinghelm Network Port Series Products Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. WSTS Says Global Semiconductor Market Doubled in H1 2026 Date: September 24, 2026Summary:WSTS data show that the global semiconductor market reached $702 billion in the first half of 2026, a 102% year-over-year increase. Memory grew 305% and logic grew 45%. Full-year 2026 is now calculated at $1.655 trillion, about 108% annual growth, while the 2027 calculation reaches approximately $2.1 trillion under current assumptions.Importance:Confirms that AI infrastructure is generating demand growth far beyond historical semiconductor cycles and is reshaping capacity allocation across memory, advanced packaging and power delivery.Source: WSTS 2. Synopsys and TSMC Add Agentic AI Flows for A14 and Advanced Packaging Date: September 23, 2026Summary:Synopsys and TSMC announced certified EDA flows for TSMC's A14 process, including agentic AI chiplet floorplan co-optimization, integrated voltage regulator support for CoWoS multi-die designs and an expanded 2nm IP portfolio that includes PCIe 7.0 and HBM4 tape-out milestones. The collaboration spans analog, digital and multi-die design.Importance:Lowers the design barrier for advanced-node and chiplet products while tying more engineering work to packaging, power integrity and HBM interfaces.Source: Synopsys; TSMC 3. Imec Demonstrates 100GHz Photodiode for 400Gbps Optical Links Date: September 21, 2026Summary:Imec introduced a 100GHz Ge/Si avalanche photodiode manufactured on its 300mm silicon photonics platform. The device enables net 400Gbps data reception at only 5V and is intended for next-generation optical interconnects in AI data centers.Importance:Improves the manufacturability case for higher-bandwidth optical links, a critical building block as electrical interconnect reaches power and distance limits in AI clusters.Source: imec 4. NVIDIA Launches DSX Ready Qualification for AI Factory Power and Cooling Date: September 21, 2026Summary:NVIDIA launched DSX Ready, a qualification program for AI factory power and cooling products. Initial qualified partner categories include battery energy storage systems from Hitachi Energy, LG Energy Solution and Tesla, and cooling distribution units from LG Electronics, LiquidStack and Vertiv.Importance:Extends AI infrastructure qualification from compute into power and thermal components, giving designers and buyers a clearer standard for high-density data-center equipment.Source: NVIDIA 5. Alibaba Unveils Zhenwu V900 AI Accelerator Date: September 22, 2026Summary:At the Yunqi Conference, Alibaba introduced the Zhenwu V900 AI accelerator. Alibaba says the chip is about three times the performance of the previous M890 generation, can scale to clusters of up to 500,000 chips and is targeted for production and commercial release in the first quarter of 2027. The company also plans companion in-house interconnect switching chips and supernode servers.Importance:Shows a Chinese cloud provider building a broader accelerator, networking and system stack, increasing domestic design pull for advanced logic, HBM, high-speed interconnect and packaging.Source: Alibaba Cloud; Reuters 6. Renesas Introduces Smallest Configurable GreenPAK IC Date: September 24, 2026Summary:Renesas introduced its smallest configurable GreenPAK IC with multi-time programmability in ultra-compact WLCSP and STQFN packages. The device is intended for space-constrained edge, consumer and industrial designs. Renesas also expanded its 64-bit RZ/G3L and RZ/G3SE MPU family for advanced HMI and IoT edge systems earlier in the month.Importance:Demonstrates continued integration and miniaturization in mixed-signal components, helping designers reduce board area and add programmable control without larger discrete logic.Source: Renesas At Kinghelm At Kinghelm, we follow advances in memory, optical interconnect and advanced packaging because they reshape the performance and supply requirements of next-generation electronic systems. These developments inform our work in RF antennas, connectors, wire harnesses, precision cables and interconnect solutions. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

Slkor M7 is specially designed for high-voltage, moderate-current application scenarios International Tech News: Samsung Electronics has incorporated "B1b" technology into its official roadmap and named it "D0a." Data shows that in the first seven months of 2026, Germany imported about 175,000 passenger cars from China, a sharp year-on-year increase of 120.9%. Doosan Group plans to invest 420 billion won to expand its optical module copper-clad laminate production line in South Korea, and invest another 550 billion won to build a new copper-clad laminate plant in China. Jensen Huang expects Nvidia's chip sales in 2027 to be about twice that of 2026. Reports say the overall yield rate of Apple's iPhone Duo is only just over 60%. South Korea's HBM-related products produced by Samsung Electronics and SK Hynix saw exports to Malaysia surge 5.7 times within a year. Domestic Tech News: Biwin Storage plans to cooperate with the Dongguan Songshan Lake High-Tech Zone Management Committee to invest in and build Phase III of a wafer-level advanced packaging and testing manufacturing project, with a total investment of about 4.5 billion yuan. On September 22, Hygon Information officially released in Shenzhen its first chip aimed at physical-world scenarios such as industrial control — the Hygon 1000 series CPU. Slkor (www.slkoric.com) A7/M7/FR107/1N4148W four types of diodes are still in the midst of a major discount campaign. The event runs until October 10. Customers are welcome to inquire and place orders. Alibaba Cloud publicly unveiled its self-developed silicon photonics wafer at the 2026 Apsara Conference. The production line at the SABAR headquarters base of Aifo Guangtong was lit up in Guangzhou Knowledge City, with an expected annual output of 6 billion filter chips and a total project investment of 3 billion yuan. BOE will invest more than 80 billion yuan in R&D over the next five years and announced its entry into glass substrates. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Song Shiqiang of Kinghelm at the 2026 Third Chip Growth Forum International Tech News: Qualcomm launches the Snapdragon 8 Elite Gen 6 and Snapdragon 8 Super Elite Gen 6, redefining the ceiling of Android flagships with a "dual-flagship" strategy. ByteDance plans to invest RMB 100 billion (about US$14.9 billion) annually by 2030 in large-scale procurement of chip packaging substrates. Industry insiders say machines are becoming the main force of thinking, intelligence is becoming a commodity at scale, and the total amount of machine thinking will exceed that of humans by more than 1,000 times in the future. From September 19 to 24, the 2026 Aerospace Information and Satellite Internet Innovation and Development Conference, themed "Building the Aerospace Foundation, Pioneering a Stellar Journey," was held at the Xiong’an Convention and Exhibition Center. Products under Kinghelm's brand (www.kinghelm.net), including Type-C, SMA, IPEX, MCX, and HDMI connectors, automotive wiring harnesses, adapter cables, pin headers, terminals, RF cables, antennas, GPS antennas, RF coaxial connectors, WiFi antennas, BeiDou antennas, internal antennas, 4G antennas, ceramic antennas, RF connectors, electronic components, sensors, millimeter wave, earphone jacks, DC jacks, FPC connectors, USB connectors, waterproof USB, tactile switches, Type female sockets, Type-C interfaces, and other products, are selling well both online and offline! In 2025, the global market for diamond materials for semiconductors is about US$1.38 billion, and the global market is expected to exceed US$16 billion by 2032. Domestic Tech News: T-Head releases its new-generation training-inference integrated AI chip, Zhenwu V900. Galaxy Microelectronics plans to invest RMB 1.078 billion to implement the "High-end Core Device Industrialization and Innovation Capability Construction Project." The All-China Federation of Industry and Commerce releases the 2026 "China Top 500 Private Enterprises" and "China Top 500 Private Manufacturing Enterprises" lists. Shenzhen Huanchuang Technology Co., Ltd. will be listed on September 30, with net proceeds of approximately HK$615.4 million. X-Epic joins hands with Dishui Zhixing to advance trusted AI automotive-grade safety applications and jointly build a large-model vehicle control safety assurance system. As of August 31, 2026, the installed base of BYD’s God’s Eye assisted-driving models exceeded 3.72 million units, of which 201,533 were sold in August. Kinghelm's Yang Xiaocui (left) and Song Yuanming Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

SLKOR and Kinghelm Mid-Autumn Festival and National Day Holiday Notice International Tech News: Corning announced that yen-denominated display glass substrate prices will rise by more than 15%, effective in Q4 2026. South Korea’s exports in the first 20 days of September hit a record high, with semiconductor exports surging 259.4% to $34.128 billion. Samsung Electronics’ union has transformed into an organization focused on the semiconductor "Device Solutions" unit, and currently only employees in the semiconductor division can join. According to the International Federation of Robotics, about 7,000 humanoid robots for industrial and professional service applications were sold globally in 2025. Apple is working with Broadcom to advance Baltra, its first self-developed AI server chip, which is expected to enter mass production in the second half of 2026 and be deployed in 2027. The Terafab chip factory jointly built by Musk’s Tesla, SpaceX and xAI has been temporarily suspended. Domestic Tech News: It is reported that Nexperia China has completed the full adoption of a domestic 12-inch wafer platform, eliminating its dependence on European front-end wafer supply. Counterpoint data shows that in the first half of 2026, global quadruped robot shipments totaled nearly 35,000 units, with Unitree Robotics ranking first worldwide with a market share of 37%. With the two festivals approaching, SLKOR (www.slkoric.com) and Kinghelm’s 2026 holiday schedule is as follows: Mid-Autumn Festival from September 25 to 27, and National Day from October 1 to 7, 10 days in total. Customers are kindly requested to plan their material stocking in advance. We wish you a happy Mid-Autumn Festival and National Day! According to Sina Finance, MLCC prices in Huaqiangbei have recently skyrocketed. Some popular part numbers surged 7 to 8 times within a month, and were once speculated up to 2 to 10 times their original prices. Ningbo Qiushui Semiconductor’s 8-inch hybrid bonding production line has officially come online and started production. Dianbo Weixun (Ningbo)’s independently developed GlassRadio™ technology platform has achieved a breakthrough, and the company’s first glass-based RF chip, dBT5321A, has entered mass production at scale. Chen Na and Song Shiqiang (first from the right) jointly presented iPhones to the lucky winners Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

"Dare to Be Extraordinary, March Toward Championship" — The 3rd Chip Growth Forum 2026 Successfully Concludes International Tech News: According to estimates by industry institutions, the commercial space market has exceeded RMB 2.8 trillion, and satellite internet is accelerating the opening of a hundred-billion-level industrial blue ocean. The 2026 World Manufacturing Convention, themed "Intelligent Manufacturing for a Better World," will kick off on September 20–23 at the Hefei Binhu International Convention and Exhibition Center. China Mobile and Qualcomm Technologies, Inc. successfully completed the world’s first interoperability test between a 6G prototype base station and terminal prototype in the U6G band compliant with the latest 3GPP definitions, marking a new stage of systematic verification for key 6G technologies. It is forecast that in 2026, global monthly demand for 12-inch silicon wafers will be about 10 million wafers, with a supply-demand gap of about 1.5 million wafers per month; the shortage of high-end lightly doped wafers and epitaxial wafers is expected to continue until 2028. "Dare to Be Extraordinary, March Toward Championship" — The 3rd Chip Growth Forum 2026 successfully concluded. The forum was originally initiated by CGC Xinxirang Consulting. The third directly operated store of Slkor Semiconductor (www.slkoric.com) in Huaqiangbei was the main sponsor; Song Shiqiang and Chen Na presented new Apple phones to the grand prize winners! Tower Semiconductor and NewPhotonics® have begun volume shipments of integrated laser and serviceable optical engine products. Domestic Tech News: On the afternoon of September 19, Kinghelm (www.kinghelm.net) and Slkor held a team-building training activity. The Slkor Warriors basketball team and the Kinghelm badminton team welcomed new members! The 5th GMIF Innovation Summit, co-hosted by the Shenzhen Memory Industry Association and others, will open on September 23 at the Renaissance Shenzhen Bay Hotel. ChangXin Memory Technologies announced mass production of its fifth-generation DRAM technology platform (G5 platform). Recently, Zhejiang Jingneng Microelectronics Co., Ltd. completed a Series C financing round of RMB 630 million. The 2026 China Semiconductor Packaging and Testing Technology and Market Annual Conference will be held from November 4 to 6 at the Fengda International Hotel in Nanjing. On September 19, the advanced IC substrate digital-intelligent manufacturing base at the second campus of Liding Semiconductor Technology (Shenzhen) Co., Ltd. was officially inaugurated in Bao'an District. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. Winbond to Acquire Infineon NOR Flash and F-RAM Business for $1.12 Billion Date: September 16, 2026Summary:Winbond Electronics agreed to acquire 100% of Infineon Technologies' NOR Flash and F-RAM business for about $1.12 billion in cash. The acquired business is headquartered in San Jose, California, and is expected to operate independently under the revived Spansion name after the transaction closes in the second half of 2027, subject to regulatory approval. TrendForce estimates that the deal could lift Winbond's global NOR Flash share to around 34%, widening its lead while adding automotive customers and more global R&D and supply-chain resources.Importance:Consolidates a key non-volatile memory segment, reduces the number of major NOR Flash suppliers and makes long-term sourcing and second-source planning more important for automotive, industrial and networking customers.Source: Winbond; Infineon; TrendForce 2. Nexperia and Tata Electronics Extend Discrete Device Manufacturing into India Date: September 17, 2026Summary:Nexperia and Tata Electronics announced a long-term strategic partnership covering wafer fabrication, assembly and testing, technology collaboration and semiconductor ecosystem development. Nexperia's MOSFET portfolio is expected to be manufactured at Tata Electronics' planned 300mm wafer fab in Dholera, Gujarat, while discrete semiconductor products will be assembled and tested at its facility in Jagiroad, Assam. The agreement incorporates front-end manufacturing, but the companies did not disclose production volumes, product introduction schedules or financial terms.Importance:Expands India's role in the discrete semiconductor supply chain and creates an additional regional manufacturing path for MOSFETs and other components used in power, automotive and industrial designs.Source: Nexperia; Tata Electronics 3. Gartner Forecasts AI Spending at $2.7 Trillion in 2026 Date: September 15, 2026Summary:Gartner projects that worldwide spending on artificial intelligence will reach $2.7 trillion in 2026, a 49.5% year-over-year increase. AI infrastructure remains the largest category as hyperscalers and service providers invest in AI-optimized servers, networking equipment, processors and data-center capacity. Gartner also expects spending on AI services to create a $1.2 trillion opportunity by 2030.Importance:Sustains demand across memory, power management, networking, advanced packaging, connectors and other components, while reinforcing concerns about capacity allocation and lead-time pressure.Source: Gartner 4. SK hynix Explores Intel Ohio Site for Potential U.S. Memory Production Date: September 18, 2026Summary:Reuters reported that SK hynix and Intel held exploratory discussions about manufacturing memory chips in the United States. One possible structure could involve SK hynix leasing part of Intel's planned Ohio semiconductor manufacturing site; another could involve a joint venture with Intel and major cloud customers. No agreement has been finalized, and the memory products under consideration remain unclear.Importance:Shows memory suppliers exploring geographically diversified production to reduce supply-chain risk. U.S.-made DRAM or HBM could eventually change regional sourcing options and lead times.Source: Reuters 5. CXMT Puts Fifth-Generation DRAM Platform into Mass Production Date: September 20, 2026Summary:At the World Manufacturing Convention in Hefei, CXMT said its fifth-generation DRAM platform has entered mass production. The platform narrows the DRAM storage-array active-area half pitch to 11.95nm and uses multi-patterning techniques. Two 24Gb LPDDR5X chips based on the platform are also in production. CXMT says the node can produce at least 50% more gross dies per wafer than its fourth-generation platform when compared on an 8Gb die basis, and that key process steps were developed with Chinese equipment suppliers.Importance:Marks a step from matching mainstream product specifications toward advancing domestic DRAM process technology. Independent yield data and evidence of large-scale HBM production are still limited.Source: Reuters; CXMT 6. Huawei Accelerates Ascend 960 Roadmap and Adds Optical Interconnect Date: September 17, 2026Summary:Huawei moved its Ascend 960DT target to the first quarter of 2027, three quarters earlier than originally planned, and brought Ascend 960PR forward by one quarter. The company also outlined an annual Ascend cadence and introduced Atlas 960E SuperPoD, which can connect up to 4,096 NPUs, claims 8 EFLOPS of FP8 performance, supports up to 1PB of HBM and uses a new Hi-ONE near-package optical interconnect rated at 7.2Tbps per optical engine. Huawei separately said domestic demand for its AI equipment is greater than its production capacity.Importance:Highlights how Chinese AI systems increasingly depend on architecture, HBM, optical interconnect and advanced packaging, while advanced foundry capacity remains the main constraint on volume.Source: Huawei; Reuters At Kinghelm At Kinghelm, we track shifts in memory, power and AI infrastructure that influence component availability and design priorities. These signals guide our work in RF antennas, connectors, wire harnesses, precision cables and interconnect solutions for next-generation electronics. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

A7/M7/FR107/1N4148W special offer ends October 10 International Tech News: Samsung Display plans to invest 300 billion won to build an RGB OLEDoS production line, targeting the core microdisplay panel market for next-generation XR devices. The 2026 Functional Verification Study shows that the first-pass tape-out success rate for IC/ASIC projects plunged from 14.4% to 5% within two years, with only 5% of teams succeeding. Sources say Japanese photoresist suppliers plan to raise prices starting October 1, 2026, with an overall increase of about 15%, and some ArF products rising by more than 20%. Anderon, IBM’s quantum wafer foundry company, has received $1 billion in R&D funding, which will be used for 300mm (12-inch) quantum wafer manufacturing and R&D. Nexperia and Tata Electronics have reached a cooperation agreement to jointly produce and package chips in India. Tesla’s AI5 chip is in trial production at Samsung’s Texas plant and has entered the yield verification stage, with mass production verification planned to be completed by the end of this year. Domestic Tech News: Huangshan Chaoyuan Semiconductor’s "AI-empowered high-end semiconductor intelligent testing project" has started construction, with an initial phase of 350 million yuan to establish wafer and finished-product testing production lines. Guojia Gujing achieved stable mass production of 2-inch and 4-inch zero-twin gallium oxide substrates, and made a major industrialization breakthrough in 6-inch zero-twin gallium oxide. Song Shiqiang, General Manager of Slkor (www.slkoric.com), will attend the Third Core Growth Forum this afternoon. Industry chain sources say BOE will adjust prices for its display series products, effective from the fourth quarter of 2026. TCL CSOT and HKC have also successively been reported to raise prices. As of June 30, 2026, Evergrande Auto’s total liabilities reached 32.722 billion yuan, and it has exited the automobile manufacturing business. Yixing Intelligent completed nearly 2 billion yuan in financing, and its RISC-V cloud AI computing chip Epoch has been mass-produced and delivered. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: In Q2 2026, the yield of Intel’s Panther Lake processor compute chip built on the 18A process reached about 80%. The reports Intelligent World 2035: From Vision to Action and Global Digital Intelligence Index (GDII) 2026 were released. Intelligent World 2035 systematically addresses the core challenges of the Agentic AI era. Corning announced a global price adjustment of 15% or more for Japanese yen-denominated display glass substrate products. TrendForce expects global shipments of 800G optical modules to reach 50–60 million units in 2026, and 1.6T optical modules to reach 20–30 million units. Starting September 17, Kinghelm (www.kinghelm.net) and Slkor are giving benefits to employees and friends in the industry. Huili soft-seeded pomegranates and Mid-Autumn Festival mooncake gift boxes symbolize "Liu" (pomegranate) six-six smoothness and a happy reunion! It is estimated that global demand for analog chips for optical modules will exceed RMB 10 billion in 2026. Domestic Tech News: Xi'an Jiaotong University and other institutions developed textured ceramics with piezoelectric performance comparable to that of single crystals through machine learning-assisted design. Ascend 970 and Ascend 980 chips will be launched successively in 2028 and 2029. In the first half of 2026, 186 A-share semiconductor listed companies collectively achieved net profit attributable to parent companies of RMB 160.506 billion, up 607.2% year on year. D-Robotics announced the completion of a US$400 million Series C funding round. Shandong Ruifeng Polymer Materials Co., Ltd. plans to acquire no less than 51% equity in Anhui Mituo New Material Technology Co., Ltd. NI Days China will be held on October 28, 2026, at the Shanghai International Convention Center. Kinghelm Network Port Series Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor FR107 at a Big Discount—Welcome to Inquire About Pricing International Tech News: Institutions estimate that the global silicon wafer supply-demand gap will expand from about 8% at the end of 2026 to 15% in 2027 and 24% in 2028. Samsung Electro-Mechanics and Qualcomm are jointly developing organic bridge technology for 2.1D packaging to connect multiple semiconductor chips within a single package. TDK plans to invest 40 billion yen in two Japanese plants over the next three years to expand production equipment for thin-film inductors used to stabilize current. Japanese chemical manufacturer Resonac has successfully developed a 300 mm (12-inch) silicon carbide (SiC) single-crystal substrate. Dutch company Axelera has released its second-generation AI chip "Europa," which can be used in selected Dell and Supermicro products. Hanmi Semiconductor has signed an equipment purchase order with Elon Musk’s TerraFab project and will supply advanced packaging equipment for AI system-on-chip production. Domestic Tech News: South Korean media reported that China’s wafer fab equipment localization rate rose to 35% in 2025, up 10 percentage points from 2024, and is forecast to rise further in 2026. Chipmore Technology’s RMB 2.454 billion Suzhou advanced packaging project has been launched, focusing on heterogeneous integration packaging of optical chips and electrical chips. Slkor (www.slkoric.com) has launched a comprehensive upgrade of its three directly operated stores in Huaqiangbei, refreshing both its brand image and service experience. The G6 full-size inkjet printing equipment for printed displays independently developed by Guochuangke has been introduced into the mass production line of a leading panel manufacturer. Winbond Electronics plans to acquire 100% equity of Infineon’s NOR Flash and F-RAM businesses for US$1.12 billion. Hong Kong, China, released the First Five-Year Plan for Economic and Social Development of the Hong Kong Special Administrative Region (2026–2030), which will comprehensively advance the "AI+" initiative. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.